Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Karlsruher Institut für Technologie
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Zusatztext
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Weitere Details
Erschienen: 12.02.2018
Umfang: 256 S., 89 farbige Illustr.
Sprache: ENG
Einband: KT
Format: 1.6 x 21 x 14.8 cm
ISBN/EAN: 9783731507468
Umbreit-Nr.: 3783480
