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Materials for Advanced Packaging

Cover von Materials for Advanced Packaging

Daniel Lu/C P Wong

Springer Verlag GmbH

213.99

(inklusive MwSt.)

Verfügbarkeit: Vergriffen, Bestellung abgelegt

Zusatztext

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.

Weitere Details

Erschienen: 10.12.2008

Umfang: xii, 724 S., 300 s/w Illustr., 724 p. 300 illus.

Sprache: ENG

Einband: GEB

ISBN/EAN: 9780387782188

Umbreit-Nr.: 1746189

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